BeSang Inc. v. Micron Technology Inc. — Fed. Cir. (Oct 6, 2026)
The Federal Circuit hears BeSang's patent dispute with Micron over memory chips and storage drives. In 2023, BeSang sued Micron in the Eastern District of Texas, alleging infringement of its patent for vertically arranged memory structures. The case turned on the phrase stackable add-on layer. Claim construction means determining what a patent's claim language covers. The district court interpreted that phrase to exclude layers built in place by sequential deposition. The practical question is whether the layer must be made separately and then attached, rather than built up directly on the underlying material. Both sides agreed that, under the court's reading, Micron's accused products did not infringe, and judgment was entered for Micron. BeSang appealed. The lawyers also refer to separate Patent Trial and Appeal Board proceedings about patent validity; this appeal concerns infringement. Ms. Haley will ask the court to reject the manufacturing restriction and permit a broader reading of the patent.
BeSang Inc. v. Micron Technology Inc. (No. 26-1085) — U.S. Court of Appeals for the Federal Circuit, argued October 6, 2026.
- 0:00Introduction
- 9:57Advocate — John Kappos