Intel Corporation v. BeSang Inc. — Fed. Cir. (Oct 6, 2026)
Intel and BeSang dispute a patent for three-dimensional memory chips. BeSang sued Intel in Oregon in 2023, alleging infringement of its patent. The patent describes adding memory-cell layers above a separately fabricated base to increase chip density. Intel challenged claims one and thirteen through seventeen at the Patent Trial and Appeal Board, arguing that earlier publications made them obvious. Obviousness asks whether an ordinarily skilled person would have arrived at the claimed invention from what was already known. The Board found Intel had not proved any of those claims unpatentable, and Intel now seeks reversal or a new Board review. This appeal concerns patent validity, not whether Intel's products infringe. Two questions dominate: whether Intel's original petition properly set out its challenge to the claimed stackable add-on layer, and whether there was sufficient reason to combine earlier techniques. Claim construction means deciding what a patent claim's words cover. Mr. Bowen will argue for Intel that its petition did identify the relevant teachings and that the Board demanded too much proof before combining them.
Intel Corporation v. BeSang Inc. (No. 25-1377) — U.S. Court of Appeals for the Federal Circuit, argued October 6, 2026.
- 0:00Introduction
- 15:59Advocate — Ms. Armond